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About Integrated Circuits (IC's)
Integrated Circuits (aka IC's)
Mehile "Mo" Orloff:
Mehile Orloff is one of the founding members of VCI, and has been an integral part of our growth from
the beginning.
The term Integrated Circuit encompasses a broad array of component types. Since we have to start somehwere, we will attempt to cover the most common types first, then add to those as we go along.
Mehile "Mo" Orloff:
Mehile Orloff is one of the founding members of VCI, and has been an integral part of our growth from
the beginning.
- Programable Logic - A PLD (Programmable Logic Device) is a combination of a logic device and a memory device. These chips can be programmed to perform all manner of tasks, from very simple comparator operations to complex software-like functions, all in hardware!... more
David Hazel:
David Hazel has been a key player for VCI since April of 2008. Not only is he a blast to have around the shop, but as our inhouse engineer, his knowledge and skill-sets have proven invaluable time and time again. - Microcontrollers - In layman's terms, microcontrollers contain programming, the means to execute that programming, and the capability to issue commands to external devices ... all in one chip, like a mini computer. ... more
David Hazel:
David Hazel has been a key player for VCI since April of 2008. Not only is he a blast to have around the shop, but as our inhouse engineer, his knowledge and skill-sets have proven invaluable time and time again. - Memory - there are two main categories for memory:
Mehile "Mo" Orloff:
Mehile Orloff is one of the founding members of VCI, and has been an integral part of our growth from the beginning.- Volatile Memory - Volatile memory is memory that loses its data when unplugged. Computer RAM is one common example ... more
- Non-Volatile Memory - Non-volatile memory is memory that can be unplugged and still retain its data. Computer hard drives and camera memory cards are both examples of non-volatile memory ... more
General Notes:
IC Body Styles:
- This list is by no means complete, but includes many of the most common package types ... plus a few obscure ones.
- When these acronyms use the word “lead” it is a synonym for “pin,” not the periodic table element!
- These acronyms are only loosely standardised
- Manufacturers use varying acronyms to refer to some of the same types of chip packages
- Ceramic chips are easy to identify by their sandwich, or “Oreo cookie” look.
- CLDCC
- Ceramic LeadeD Chip Carrier
- CQJB
- Ceramic Quad J-Bend
- BGA
- Ball Grid Array
- DIP
- Dual In-Line Package
- Dual In-Line Pin
- DO
- Diode Outline package
- LCC (same as CLCC)
- Leadless Chip Carrier
- CLCC (same as LCC)
- Ceramic Leadless Chip Carrier
- LGA
- Land Grid Array
- MLP
- Micro Lead frame Package
- PGA
- Pin Grid Array
- PLCC
- Plastic Leaded Chip Carrier
- PQFP
- Plastic Quad Flat Package
- PSOP
- Plastic Small Outline Package
- QFP
- Quad Flat Package
- SIP
- Single In-line Package
- Single In-line Pin
- SOIC
- Small Outline Integrated Circuit
- Notes:
- These may conform to either the JEDEC or the EIAJ standard
- EIAJ SOIC body
- Thicker and slightly longer than JEDEC
- Approximately 5.3mm (0.209") wide
- JEDEC SOIC body
- Approximately 3.8mm (0.150") wide
- SOT
- Small Outline Transistor
- Note: These do not have to be transistors.
- SSOP
- Shrunk Small Outline Package
- TO
- Transistor Outline package
- TQFP
- Thin Quad Flat Pack
- TSOP
- Thin Small Outline Package
- TSSOP
- Thin Shrunk Small Outline Package
- UTSOP
- Ultra Thin Small Outline Package
- WSON
- Very Very thin Small Outline Non-leaded Package
- ZIP
- Zig-zag In-line Package